
说明
ASM TECH - GOLD WIRE BALL BONDER配置
无配置OEM 型号描述
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
152911
晶圆尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部ASM
Eagle AERO
类别
Wire / Wedge / Ball Bonder
上次验证: 6 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
152911
晶圆尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ASM TECH - GOLD WIRE BALL BONDER配置
无配置OEM 型号描述
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文件
无文件