说明
无说明配置
无配置OEM 型号描述
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文件
无文件
ASM
Eagle AERO
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114051
晶圆尺寸：
未知
年份：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
Eagle AERO
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114051
晶圆尺寸：
未知
年份：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文件
无文件