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市场 > Wire / Wedge / Ball Bonder > ASM > EAGLE XTREME GOCU

EAGLE XTREME GOCU

概述

The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder

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