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说明
Working Condition.配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
35555
晶圆尺寸：
未知
年份：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME GOCU
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
35555
晶圆尺寸：
未知
年份：
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Working Condition.配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder文件
无文件