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ASM EAGLE XTREME GOCU
  • ASM EAGLE XTREME GOCU
说明
Working Condition.
配置
无配置
OEM 型号描述
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder
文件

无文件

类别
Wire / Wedge / Ball Bonder

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

35555


晶圆尺寸:

未知


年份:

2017


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASM

EAGLE XTREME GOCU

verified-listing-icon
已验证
类别
Wire / Wedge / Ball Bonder
上次验证: 60 多天前
listing-photo-993d850e69604f91af11032a483342bf-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44714/1a61f8ef9e5e4bd8983719fd37468197/b3a1e4691cca463f810ba73516edb660_9884e612a840456288f90127ae419cbf1201a_mw.jpeg
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

35555


晶圆尺寸:

未知


年份:

2017


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Working Condition.
配置
无配置
OEM 型号描述
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder
文件

无文件