跳至主要内容
Moov logo

Moov Icon
ASM iHAWK-V
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes. Wire Bonder
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Wire / Wedge / Ball Bonder

    上次验证: 7 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    142470


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    ASM iHAWK-V

    ASM

    iHAWK-V

    Wire / Wedge / Ball Bonder
    年份: 0状况: 二手
    上次验证7 天前

    ASM

    iHAWK-V

    verified-listing-icon
    已验证
    类别
    Wire / Wedge / Ball Bonder
    上次验证: 7 天前
    listing-photo-6e2f25c96da44a04ac20197402a09206-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73489/6e2f25c96da44a04ac20197402a09206/0c7e3b69213041888f65f00bf7f84781_photodec11202530441pm_mw.jpg
    listing-photo-6e2f25c96da44a04ac20197402a09206-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73489/6e2f25c96da44a04ac20197402a09206/7ea0e8eb7a494c50aa01c9282f911e7e_photodec11202530430pm_mw.jpg
    listing-photo-6e2f25c96da44a04ac20197402a09206-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73489/6e2f25c96da44a04ac20197402a09206/c14ab640a03b4292b78ca4ad823aa074_photodec11202530440pm_mw.jpg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    142470


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The ASM iHAWK-V bonders are advanced semiconductor bonding machines developed by ASM Assembly Systems, a division of ASM Pacific Technology Ltd. These bonders are specifically designed for high-precision and high-throughput semiconductor assembly processes. Wire Bonder
    文件

    无文件

    类似上架物品
    查看全部
    ASM iHAWK-V

    ASM

    iHAWK-V

    Wire / Wedge / Ball Bonder年份: 0状况: 二手上次验证:7 天前