说明
无说明配置
无配置OEM 型号描述
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.文件
无文件
ASM
EAGLE XPRESS GOCU
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114003
晶圆尺寸：
未知
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XPRESS GOCU
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114003
晶圆尺寸：
未知
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The ASM Eagle Xpress Gocu is a type of ball bonder used in the semiconductor industry. The power requirements for the ASM Eagle Xpress Gocu are 220 V, 7.2 A, 50/60 Hz, 1 Phase. A ball bonder is a type of semiconductor assembly equipment used for wire bonding. It is capable of ball bumping and customized looping profiles.文件
无文件