说明
Wafer balling配置
无配置OEM 型号描述
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文件
无文件
KULICKE & SOFFA (K&S)
AT PREMIER
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104327
晶圆尺寸：
未知
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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KULICKE & SOFFA (K&S)
AT PREMIER
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104327
晶圆尺寸：
未知
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer balling配置
无配置OEM 型号描述
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文件
无文件