说明
Wafer balling配置
无配置OEM 型号描述
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104327
晶圆尺寸：
未知
年份：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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KULICKE & SOFFA (K&S)
AT PREMIER
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
104327
晶圆尺寸：
未知
年份：
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer balling配置
无配置OEM 型号描述
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.文件
无文件