说明
无说明配置
无配置OEM 型号描述
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonder文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120151
晶圆尺寸：
未知
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
ConnX PLUS
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
120151
晶圆尺寸：
未知
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
"""High productivity bonder for low-to-medium pin count applications."" ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity: Interactive Programmable Look Ahead Vision to ease first time set-up Power Series Xpress Loop to help increase the productivity of short wire applications Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.""" Wire Bonder文件
无文件