说明
Asset name- Automatic batting machine Asset name - Wire Bonder Specifications- Max one ultra配置
无配置OEM 型号描述
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder文件
无文件
KULICKE & SOFFA (K&S)
Maxµm Ultra
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 5 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
118318
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
Maxµm Ultra
类别
Wire / Wedge / Ball Bonder
上次验证： 5 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
118318
晶圆尺寸：
未知
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Asset name- Automatic batting machine Asset name - Wire Bonder Specifications- Max one ultra配置
无配置OEM 型号描述
"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™. The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Bond Force Control System with Piezo Sensor Technology Advanced Low Friction Wire Feed System Fully Programmable BITS System Latest PC-based Processing Power Small Ball Detection Maxµm ultra Enhanced Performance UPH +10% over the Maxµm plus ±2.5µm Accuracy for 35µm Pitch Production Copper Wire Bonding Capable Wire Bonder文件
无文件