说明
Wedge Bond配置
无配置OEM 型号描述
"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H). Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations. Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."文件
无文件
KULICKE & SOFFA / ORTHODYNE
M360C
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115612
晶圆尺寸：
未知
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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KULICKE & SOFFA / ORTHODYNE
M360C
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115612
晶圆尺寸：
未知
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wedge Bond配置
无配置OEM 型号描述
"Introducing the Model 360 large wire bonder, a cutting-edge system designed to enhance your productivity. With an impressive bonding rate of 70 bonds per minute, it outperforms previous systems by increasing throughput by 25%. Despite its powerful capabilities, this wire bonder boasts compact dimensions, measuring only 60cm (W) x 105cm (D) x 182cm (H). Equipped with a deep access bond head and an exclusive pattern recognition system, the Model 360C system automates the bonding process for a wide range of electronic packages. Whether you require aluminum or copper wire measuring 125 to 650 um, this system has you covered. Thanks to its computer-controlled four-axis bond head, you can easily bond various types of modules, lead frames, and hybrid substrates. The travel lengths are 6 inches (x direction), 10 inches (Y direction), and 2 inches (Z direction), ensuring flexibility in your bonding operations. Furthermore, the Model 360 large wire bonder ensures exceptional precision, with bond head positioning accuracy within 1um. Trust in this advanced system to optimize your productivity and streamline your electronic bonding tasks."文件
无文件