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说明
SPECIFICATIONS MICROPROCESSOR: TI 990,16 Bit MEMORY: Battery Backup Ram. DISPLAY: LCD: 40 Character, 3-line, English / Foreign languages. DATA ENTRY: Digital Switch,0-999. DEVICE STORAGE BUFFERS: 30 MANIPULATOR: Single-lever X-Y-Z, 8:1 Ratio. THROAT DEPTH: 6 inches. WORKING ENVELOPE: 12 inches square x 2.687 inches high. WORK HEIGHT ADJUSTMENT: 0.625 inches. WORK PLATFORM: With 6 inch rotary, or without (choice). WORK HOLDERS: Heated or unheated, interchangeable FEATURES MICROPROCESSOR-CONTROLLED machine variables with dynamic LCD status indicators. ALL PRE-SET VALUES tracked and displayed with memory for three device types. 12 INCH WORKING ENVELOPE for large modules or MCMS. FAULT DIAGNOSTICS. HEATED and UNHEATED workholders, custom made. PROGRAMMABLE LOOP and PROGRAMMABLE STITCH PROGRAMMABLE TAIL/PULL STROKE. LOAD CELL feedback of bond force values displayed in real time ENCODED Z AXIS with positional feedback. 8 BIT CONTROL of ultrasonic power and time over any bond. DETATCHABLE WORK PLATFORM with single-knob, pure vertical height adjustment (5/8″). FEATHER-LIGHT and COUNTERBALANCED X-Y-Z mechanism 90 DEGREE DEEP-ACCESS TOOL ASSEMBLY convertible wit 45 degree tool assembly.配置
无配置OEM 型号描述
Wire Bonder文件
无文件
WESTBOND
7400B
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
125445
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
SPECIFICATIONS MICROPROCESSOR: TI 990,16 Bit MEMORY: Battery Backup Ram. DISPLAY: LCD: 40 Character, 3-line, English / Foreign languages. DATA ENTRY: Digital Switch,0-999. DEVICE STORAGE BUFFERS: 30 MANIPULATOR: Single-lever X-Y-Z, 8:1 Ratio. THROAT DEPTH: 6 inches. WORKING ENVELOPE: 12 inches square x 2.687 inches high. WORK HEIGHT ADJUSTMENT: 0.625 inches. WORK PLATFORM: With 6 inch rotary, or without (choice). WORK HOLDERS: Heated or unheated, interchangeable FEATURES MICROPROCESSOR-CONTROLLED machine variables with dynamic LCD status indicators. ALL PRE-SET VALUES tracked and displayed with memory for three device types. 12 INCH WORKING ENVELOPE for large modules or MCMS. FAULT DIAGNOSTICS. HEATED and UNHEATED workholders, custom made. PROGRAMMABLE LOOP and PROGRAMMABLE STITCH PROGRAMMABLE TAIL/PULL STROKE. LOAD CELL feedback of bond force values displayed in real time ENCODED Z AXIS with positional feedback. 8 BIT CONTROL of ultrasonic power and time over any bond. DETATCHABLE WORK PLATFORM with single-knob, pure vertical height adjustment (5/8″). FEATHER-LIGHT and COUNTERBALANCED X-Y-Z mechanism 90 DEGREE DEEP-ACCESS TOOL ASSEMBLY convertible wit 45 degree tool assembly.配置
无配置OEM 型号描述
Wire Bonder文件
无文件