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BRUKER D8 FABLINE
    说明
    Bruker D8 Fabline
    配置
    - Handler System: Automation software PTO from Peer Group - Pattern recognition software - Software Version: 77-2.3A-6A-5A-5A-R6A - Primary optics for micro diffraction, TXS X-ray system - Scanning range of two theta: min. 28° – max. 99°, Omega is limited to min. 30° max. 80° to avoid collision with 300mm wafer chuck - Stage is multi-sample holder (D8 FABLINE is designed for automated process and equipped only with wafer chuck for 300mm and standard Bruker sample holder for adjustment) - Motorized slits and fixed slit 2mm primary side (tube), secondary side LynxEye XE Detector - Wafer chuck and standard sample holder - Fully automated - X-ray source: TXS point focus (50kV 50mA) generator installed in the electronic cabinet behind the tool
    OEM 型号描述
    The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.
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    BRUKER

    D8 FABLINE

    verified-listing-icon

    已验证

    类别
    X-Ray

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    84211


    晶圆尺寸:

    12"/300mm


    年份:

    2015

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    Logistics Support
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    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
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    BRUKER D8 FABLINE

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    D8 FABLINE

    X-Ray
    年份: 2015状况: 二手
    上次验证30 多天前

    BRUKER

    D8 FABLINE

    verified-listing-icon
    已验证
    类别
    X-Ray
    上次验证: 30 多天前
    listing-photo-b766110ff34c4e00bf113bce9a24a115-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/b766110ff34c4e00bf113bce9a24a115/a9fe91a9f5b246868df066232b76592e_dc7cb4cd3905444fa904740966d6994a1201a_mw.jpeg
    listing-photo-b766110ff34c4e00bf113bce9a24a115-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/b766110ff34c4e00bf113bce9a24a115/5bc6ca3060604f51a8a01321a33d0de1_ad50b788b8aa4a9eaa746b9a2473036e45005c_mw.jpeg
    listing-photo-b766110ff34c4e00bf113bce9a24a115-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/b766110ff34c4e00bf113bce9a24a115/729aab7269e9497b914fb234d74d1b7c_6ffbab59b1524646817af8a0ebcdfe30_mw.jpeg
    listing-photo-b766110ff34c4e00bf113bce9a24a115-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2046/b766110ff34c4e00bf113bce9a24a115/db699c57e3bb4a34ab1984ce584d7eb0_d1f2f39416f543ecaf459127cbc53f98_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    84211


    晶圆尺寸:

    12"/300mm


    年份:

    2015


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Bruker D8 Fabline
    配置
    - Handler System: Automation software PTO from Peer Group - Pattern recognition software - Software Version: 77-2.3A-6A-5A-5A-R6A - Primary optics for micro diffraction, TXS X-ray system - Scanning range of two theta: min. 28° – max. 99°, Omega is limited to min. 30° max. 80° to avoid collision with 300mm wafer chuck - Stage is multi-sample holder (D8 FABLINE is designed for automated process and equipped only with wafer chuck for 300mm and standard Bruker sample holder for adjustment) - Motorized slits and fixed slit 2mm primary side (tube), secondary side LynxEye XE Detector - Wafer chuck and standard sample holder - Fully automated - X-ray source: TXS point focus (50kV 50mA) generator installed in the electronic cabinet behind the tool
    OEM 型号描述
    The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.
    文件

    无文件

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