Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits. Supplier of plasma and rapid thermal processing (RTP) equipment to the global semiconductor industry, and operate in four primary product sectors: Dry Strip, Etch, Rapid Thermal Processing and Millisecond Anneal.

The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. The unique process chamber architecture can accommodate technical requirements across multiple technology nodes for the most demanding device manufacturers in the industry.

MATTSON

ASPEN III

MATTSON Aspen II is Etchers & Ashers system. the Aspen II can be used with 8” wafer size.
Aspen II is based on a highly reliable and productive system design. It provides proven process capabilities and cost of ownership benefits in high volume manufacturing to chipmakers worldwide.

ASPEN II

Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.

HELIOS

The Millios is based on proprietary water-wall argon arc lamp technology. The system design monitors and controls wafer front-side and backside temperature in real time. The system has excellent wafer temperature control capabilities, including unique millisecond anneal pulse duration adjustment capability and integrated spike anneal-flash millisecond anneal process capability. It can meet technical requirements of millisecond anneal process and effectively manage wafer thermal stress to avoid wafer breakage issues at the same time. The Millios is the best technical solution for ultra-shallow-junction formation, high-k materials passivation and metal silicide formation processes in advanced transistor fabrication. It is also applicable for other materials surface anneal processes.

MILLIOS

The 300-mm Suprema strip system is based on a flexible, modular design that makes it ideal for both development and production environments. The system features vacuum and atmospheric robotics said to deliver increased throughput of greater than 300 wafers per hour. This represents more than a 40 percent improvement compared to competitive systems for bulk strip applications. Suprema's proprietary inductively coupled plasma source provides increased strip rates of over 9 microns/minute. Its vacuum robot utilizes a transfer mechanism, capable of transferring four wafers simultaneously, to minimize overhead time. Suprema can be configured with two dual-wafer modules.

SUPREMA

Built on the paradigm product architecture, paradigm Si incorporates enhancements to enable customers to run the chemistries required for poly-silicon applications. The system features Mattson Technology's proprietary Faraday shield designed to improve etch process control and enhance mean-time-between-clean (MTBC) performance by up to three times over competitive systems. The paradigm Si also enables true independent control of ion density and energy, providing improved profile control and minimized sputtering to reduce maintenance costs for the lowest cost-of-ownership. The paradigm Si is specifically targeted at semi-critical poly etch applications by providing excellent process performance with over 30% better cost-of ownership advantages over any competitive etch system currently on the market.

paradigm SI

paradigmE plasma etch systems have unique capabilities to independently control ion energy and ion density.

paradigmE

Built on the paradigmE product architecture, paradigmE Si incorporates enhancements to enable customers to run the chemistries required for poly-silicon applications. The system features Mattson Technology's proprietary Faraday shield designed to improve etch process control and enhance mean-time-between-clean (MTBC) performance by up to three times over competitive systems. The paradigmE Si also enables true independent control of ion density and energy, providing improved profile control and minimized sputtering to reduce maintenance costs for the lowest cost-of-ownership.

paradigmE SI

The Helios C200 RTP system combines superior technical performance with outstanding tool reliability. It is the ideal RTP solution for 200 mm semiconductor development and manufacturing.

HELIOS C200

paradigmE XP series products have excellent etch selectivity and low plasma damage for on-wafer devices, and are widely used for film etching in semiconductor front-end and back-end manufacturing.

paradigmE XP

PARADIGME SP

RFS3019	

Alpine is a cost effective, technology platform for both advanced plasma strip and semi-critical etch applications. Based on proprietary Faraday shield inductively coupled plasma (ICP) source design, Alpine incorporates an electrostatic chuck with bias capability to provide independent control of ion energy and ion density. Developed on a production proven platform, Alpine delivers superior productivity and cost of ownership.

ALPINE

**PARTS**

The Suprema III utilizes the advanced processing technology of the Suprema XP, while reducing both the amount of factory space required for installation and the operating cost per wafer of the new system.

SUPREMA III

The Helios XP features an advanced temperature measurement and control system combined with an active compensation algorithm for different wafer emissivities. The Helios XP can fully satisfy technical requirements in manufacturing of different semiconductor devices across various technology nodes (130 nm to 5 nm and below). The Helios XP has also demonstrated high reliability, long mean-time-between-clean, and more than 20 to 30% benefit in overall cost of ownership in mass production. It is the ideal RTP system for advanced semiconductor development and manufacturing.

HELIOS XP

The Helios III development is also focused on reducing the system's footprint and operating cost per wafer, while maintaining the leading edge conventional RTP capabilities of our Helios XP.

HELIOS III

Novyka family surface treatment, interface treatment and radical enhanced thermal treatment (RETTTM) systems provide unique solutions for critical surface treatment, interface control and materials modification capabilities, including damage free surface clean, selective surface treatment, and precise materials modification.  As part of Atomic Surface EngineeringTM and Atomic Interface EngineeringTM product portfolio, Novyka family technologies address specific process integration requirements across advanced lithography, etch, clean, thin film and diffusion unit processes, and enable cutting-edge memory and logic semiconductor device scaling and specialty semiconductor device manufacturing. 

NOVYKA

SUPREMA XP

paradigmE PAD series products have benefits in high etch rate, low plasma damage and low cost of consumables, and are the only ICP PAD etchers in mass production.

MATTSON

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