说明
无说明配置
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 型号描述
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文件
无文件
类别
AOI
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152849
晶圆尺寸：
未知
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / ORBOTECH
ULTRA PERFIX 120
类别
AOI
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
152849
晶圆尺寸：
未知
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Application - Automated Excess Copper Repair for PCB/IC Substrates Minimum Feature Size - 12um Minimum Line / Space: 10 um (0.4 mil) Minimum Laminate Thickness - 30 um Maximum Panel Size - 762 × 610 mm (30" × 24") Panel Thickness - 50~10,000 um Weight - 800 kg Equipment Dimensions (W x D x H) - 1,610 x 1,840 × 1,860 mm.OEM 型号描述
Ultra PerFix 120 automatically shapes excess copper defects down to 10μm resolution. The system delivers breakthrough capabilities for eliminating scrap by achieving perfect results in less than a minute on complex CSP, FC-CSP, BGA and FC-BGA designs.文件
无文件