说明
无说明配置
无配置OEM 型号描述
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文件
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EVGroup (EVG)
EVG501
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
60479
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG501
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
60479
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文件
无文件