说明
无说明配置
Table Top Version. Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bonding Capable of anodic bonding Ideal for R&D and pilot production applications High-vacuum capable bond chamber Windows based control software and operation interface Wafer size: up to 6”/150mm capable Tooling included for 4" & 6" wafers (bond chucks and steel pressure inserts) Anodic tooling not included Max Bond Force: 7 kN Top side heater: 550°C max. in 1°C steps Bottom side heater: 550°C max. in 1°C steps Temperature uniformity: ± 1,5 %Turbo pump and controller Roughing pump Load/unload tool System computer, monitor, and keyboard PDF Operations Manual for EVG 501 BonderOEM 型号描述
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文件
无文件
EVGroup (EVG)
EVG501
已验证
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
54938
晶圆尺寸：
4"/100mm, 6"/150mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG501
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
54938
晶圆尺寸：
4"/100mm, 6"/150mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Table Top Version. Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bonding Capable of anodic bonding Ideal for R&D and pilot production applications High-vacuum capable bond chamber Windows based control software and operation interface Wafer size: up to 6”/150mm capable Tooling included for 4" & 6" wafers (bond chucks and steel pressure inserts) Anodic tooling not included Max Bond Force: 7 kN Top side heater: 550°C max. in 1°C steps Bottom side heater: 550°C max. in 1°C steps Temperature uniformity: ± 1,5 %Turbo pump and controller Roughing pump Load/unload tool System computer, monitor, and keyboard PDF Operations Manual for EVG 501 BonderOEM 型号描述
The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.文件
无文件