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EVGroup (EVG) EVG501
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.
    文件

    无文件

    类别
    Wafer Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    60479


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    EVGroup (EVG)

    EVG501

    verified-listing-icon
    已验证
    类别
    Wafer Bonders
    上次验证: 60 多天前
    listing-photo-dff01d60059842fb83a8e548d6447328-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60479/2425cf2722b94116959535fcf530c4e1_7b94f676f7bb4a49a6ab730d8fb061cdimage9_mw.jpeg
    listing-photo-dff01d60059842fb83a8e548d6447328-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1689/60479/56d8596652e14f179bb2fb232c9ea42e_fbcc68cc22c540daab267886346fc704image10_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    60479


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.
    文件

    无文件