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PANASONIC MD-P200
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.
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    PANASONIC

    MD-P200

    verified-listing-icon

    已验证

    类别
    Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    75482


    晶圆尺寸:

    未知


    年份:

    2022

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Bonders
    年份: 2021状况: 二手
    上次验证60 多天前

    PANASONIC

    MD-P200

    verified-listing-icon
    已验证
    类别
    Bonders
    上次验证: 60 多天前
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/f2c2b545d6f242f59e9ae8bc9650b48b_6b890de09d78403f9b99bf3f1ad95ed91201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3ec38e71dbba4aee885d96cd09065bcc_0716f6aa56384f5b8231f110776cfeb345005c_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/c7e6e16ba1884f168d8fa14e5afd09e0_23f9b896e19c40979ea27b96236e2faa1201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/e97984aa302041b692970336a3004012_41bd8b999aa84e06ba3d2281b6ae11251201a_mw.jpeg
    listing-photo-92a0c71bdae14da98757e5abda2c9bf6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/55278/92a0c71bdae14da98757e5abda2c9bf6/3a5b24a12cf34962beedcff4ebe8184e_991ae0c8a99d4fe7b96ddef22c7e791745005c_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    75482


    晶圆尺寸:

    未知


    年份:

    2022


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.
    文件
    类似上架物品
    查看全部
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Bonders年份: 2021状况: 二手上次验证: 60 多天前
    PANASONIC MD-P200

    PANASONIC

    MD-P200

    Bonders年份: 2022状况: 二手上次验证: 60 多天前