说明
无说明配置
无配置OEM 型号描述
MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors.文件
PANASONIC
MD-P200
已验证
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75480
晶圆尺寸：
未知
年份：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PANASONIC
MD-P200
类别
Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75480
晶圆尺寸：
未知
年份：
2021
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available