跳至主要内容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多

Moov logo

Moov Icon
EVGroup (EVG) EVG101
  • EVGroup (EVG) EVG101
说明
Fully operational and can handle up to 200mm.
配置
无配置
OEM 型号描述
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
文件

无文件

PREFERRED
 
SELLER
类别
Coaters & Developers

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

111649


晶圆尺寸:

8"/200mm


年份:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

EVGroup (EVG)

EVG101

verified-listing-icon
已验证
类别
Coaters & Developers
上次验证: 60 多天前
listing-photo-ade020ab1d8a43aa9def55dbc62ffe97-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1509/ade020ab1d8a43aa9def55dbc62ffe97/6df5e878c8b64742ae8b373336e11311_6fdd62d4142e48a98619c23e0b289b8e_mw.jpeg
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

111649


晶圆尺寸:

8"/200mm


年份:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Fully operational and can handle up to 200mm.
配置
无配置
OEM 型号描述
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.
文件

无文件