说明
无说明配置
-Software Version CS400 4.70h(11) -CIM SECS, GEM -Process Litho Resist Spray Coater Main System Spinner Edge Cleaner 1 OK Main System Chill Plate 1 OK Main System OK Main System ADH 3 OK Handler System OK Handler System CRA 1 OK Handler System ITR 1 OK Handler System IRAM 1 OK Handler System MRA 1 OK Handler System SIM 1 OK Factory Interface FOUP 2 OK Power Box 1 OK Fire Suppression 1 OK Chiller 1 OK Solvent Cabinet 1 OK Missing/Faulty Parts/Accessories: 4-1 ITC 1 3-18 CPHP bad plate 1 4-5 COT 1 2-1 ADI (Removed) 1OEM 型号描述
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文件
无文件
类别
Coaters & Developers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103915
晶圆尺寸：
12"/300mm
年份：
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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SUSS MicroTec / KARL SUSS
ACS200 Gen3
类别
Coaters & Developers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
103915
晶圆尺寸：
12"/300mm
年份：
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
-Software Version CS400 4.70h(11) -CIM SECS, GEM -Process Litho Resist Spray Coater Main System Spinner Edge Cleaner 1 OK Main System Chill Plate 1 OK Main System OK Main System ADH 3 OK Handler System OK Handler System CRA 1 OK Handler System ITR 1 OK Handler System IRAM 1 OK Handler System MRA 1 OK Handler System SIM 1 OK Factory Interface FOUP 2 OK Power Box 1 OK Fire Suppression 1 OK Chiller 1 OK Solvent Cabinet 1 OK Missing/Faulty Parts/Accessories: 4-1 ITC 1 3-18 CPHP bad plate 1 4-5 COT 1 2-1 ADI (Removed) 1OEM 型号描述
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文件
无文件