说明
Litho配置
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 型号描述
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文件
无文件
SUSS MicroTec / KARL SUSS
ACS200 Gen3
已验证
类别
Coaters & Developers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
111541
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
SUSS MicroTec / KARL SUSS
ACS200 Gen3
类别
Coaters & Developers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Idle
产品编号：
111541
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Litho配置
-COATER CUP – 2X -DEVELOPER CUPS – 2X -Running condition Model: 200AA129 - Genmark Gencobot 8/3L Handler - Thermo Scientific A40 Chiller with PC 200 Immersion Circulator - Module 1: Spinner Module - Module 2: Filler Module - Module 3: HCV Module - Module 4: Spinner ModuleOEM 型号描述
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.文件
无文件