说明
无说明配置
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrate thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 115V 12A 50/60Hz - Input Air: CDA 90 PSI - Option: Cognex Wafer IDOEM 型号描述
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.文件
无文件
类别
Defect Inspection
上次验证： 9 天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
153576
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
KLA
CANDELA 8620
类别
Defect Inspection
上次验证： 9 天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
153576
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
- Cassette Handling - Laser: Oblique(50mW, 405nm), Normal(85mW, 660nm) - Spot size: 5㎛ x 4㎛. - Handler: Mapping, Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK - Particle detection: smaller than 0.08㎛ on silicon substrate. - Scratch: 0.1㎛ wide, 1~2nm deep. - Pits and Bumps: 20㎛ diameter, 50Å; deep. - Stains: 20㎛ diameter, 10Å; thick. - can be used for both epi and bare substrate. - can be used for Si, GaAs, Al2O3,SiC substrate. - Substrate thickness: 350㎛ ~ 1,300㎛. - Air Balance system ULPA and HEPA air filter(replaced new one). - Input Power 115V 12A 50/60Hz - Input Air: CDA 90 PSI - Option: Cognex Wafer IDOEM 型号描述
The Candela 8620 is an automated defect inspection system for LED substrates and epitaxy wafers. It provides enhanced quality control for materials such as gallium nitride, sapphire, and silicon carbide. Its proprietary optical design and detection technology can detect sub-micron defects that are not consistently identified by current inspection methods. This enables a production line monitor for yield-limiting defects, improving MOCVD reactor uptime and yield. The system can detect defects such as micro-scratches, micro-cracks, missing bumps, resist voids, hexagonal pits, and epi cracks, which can impact device performance, yield, and reliability.文件
无文件