说明
无说明配置
-P/N#: 27-156710-00 CONTROLLER,I/O,DUAL CAPACITY -P/N#: 02-125046-00 ASSY,HCM APVD ISIOC -P/N#: 02-145222-00 ASSY,ETCH ISIOC -P/N#:02-124499-00 ASSY,CASS FIELD CONN -P/N#: 02-121693-00 ASSY,PCA,TRANSER FIELD CONN -P/N#: 02-124482-00 ASSY,LOAD FIELD CONN,ISIOC -P/N#: 02-131736-00 ISIOC,HI-LO TRANSFER -P/N#: 02-131473-00 ASSY,ISIOC,LIQ COOLED PVD-PVD -P/N#: 02-124572-00 OBSOLETE, USE 02-131473-00 -P/N#: 02-145223-00 ASSY,BB-ETCH ISIOCOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
无文件
LAM RESEARCH / NOVELLUS
INOVA
已验证
类别
Deposition
上次验证： 30 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
114349
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
LAM RESEARCH / NOVELLUS
INOVA
类别
Deposition
上次验证： 30 多天前
物品主要详细信息
状况：
Parts Tool
运行状况:
未知
产品编号：
114349
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
-P/N#: 27-156710-00 CONTROLLER,I/O,DUAL CAPACITY -P/N#: 02-125046-00 ASSY,HCM APVD ISIOC -P/N#: 02-145222-00 ASSY,ETCH ISIOC -P/N#:02-124499-00 ASSY,CASS FIELD CONN -P/N#: 02-121693-00 ASSY,PCA,TRANSER FIELD CONN -P/N#: 02-124482-00 ASSY,LOAD FIELD CONN,ISIOC -P/N#: 02-131736-00 ISIOC,HI-LO TRANSFER -P/N#: 02-131473-00 ASSY,ISIOC,LIQ COOLED PVD-PVD -P/N#: 02-124572-00 OBSOLETE, USE 02-131473-00 -P/N#: 02-145223-00 ASSY,BB-ETCH ISIOCOEM 型号描述
The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.文件
无文件