说明
无说明配置
无配置OEM 型号描述
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.文件
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ASM
TWIN832
类别
Die Bonders / Sorters / Attachers
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150631
晶圆尺寸：
未知
年份：
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.文件
无文件