说明
Automatic Epoxy Die Bonders配置
无配置OEM 型号描述
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
155115
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
BESI / ESEC
2007 SSI plus
类别
Die Bonders / Sorters / Attachers
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
155115
晶圆尺寸：
未知
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Automatic Epoxy Die Bonders配置
无配置OEM 型号描述
The ESEC 2007 SSI Plus is primarily used for die bonding, may also support flip chip bonding. It is typically designed for automation and integration into larger production lines. It can be integrated with other equipment, such as pick-and-place machines or wire bonders, to form a complete assembly solution.文件
无文件