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说明
Flip Chip Attach配置
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM 型号描述
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116385
晶圆尺寸：
8"/200mm
年份：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116385
晶圆尺寸：
8"/200mm
年份：
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Flip Chip Attach配置
Main Configuration Wafer size : 8 inches FC Bonder : Flux unit Pick & Place unit Model : 2100HSFCOEM 型号描述
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文件
无文件