说明
Flip Chip Attach配置
无配置OEM 型号描述
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文件
无文件
BESI / ESEC
2100
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 17 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116382
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100
类别
Die Bonders / Sorters / Attachers
上次验证： 17 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116382
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Flip Chip Attach配置
无配置OEM 型号描述
The ESEC 2100 supports various bonding methods, such as eutectic solder bonding, adhesive bonding, or thermo-compression bonding, depending on the specific configuration or options chosen. Depending on the specific model or version, the ESEC 2100 may offer additional features such as multi-die bonding, flip chip bonding, or customized configurations to meet specific customer requirements or application needs.文件
无文件