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BESI / ESEC 2100 hS
  • BESI / ESEC 2100 hS
  • BESI / ESEC 2100 hS
  • BESI / ESEC 2100 hS
说明
无说明
配置
无配置
OEM 型号描述
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
文件

无文件

类别
Die Bonders / Sorters / Attachers

上次验证: 昨天

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127862


晶圆尺寸:

未知


年份:

2017


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

BESI / ESEC

2100 hS

verified-listing-icon
已验证
类别
Die Bonders / Sorters / Attachers
上次验证: 昨天
listing-photo-3fd1c6b224044085bbc25cdf01bc7b1d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127862


晶圆尺寸:

未知


年份:

2017


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
文件

无文件