说明
无说明配置
无配置OEM 型号描述
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127860
晶圆尺寸：
未知
年份：
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2100 hS
类别
Die Bonders / Sorters / Attachers
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127860
晶圆尺寸：
未知
年份：
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.文件
无文件