说明
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)配置
无配置OEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
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BESI / DATACON
2200 EVO
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118453
晶圆尺寸：
未知
年份：
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 EVO
类别
Die Bonders / Sorters / Attachers
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118453
晶圆尺寸：
未知
年份：
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
BESI Datacon 2200 EVO Flexible Multi-Chip Die Bonder High accuracy and high productivity DOM: 2019 Less than 100 operating hours...VERY LOW USE! Wafer Table Tool Changer Unit 7 Slots Main – Musashi Super Sigma V2 Internal Vacuum Pump P-part at Main AXIS Microscope 12" (FF-123) adapter for 2" and/or 4" Wafflepacks and Gelpaks (4x 2" and 2x 4") 2" WP-Adapter (12"-FF123) - 23 up - side clamp (any WT) 4" WP-Adapter - (12"-FF123) - 7 up - side clamp (std WT) 2" GP-Adapter - (12"-FF123) - 22 up - (any WT) 4" GP-Adapter - 12" (FF123) - 7 up - (std WT)配置
无配置OEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
无文件