说明

High-precision multi-chip pasting process for semiconductor integrated circuits, MEMS sensors, microwave radio frequency devices and other product packaging. Equipment name: Flexible Multi-Chip Die Bonder

配置

Configuration attached below

OEM 型号描述

The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.