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无配置OEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
PREFERRED
SELLER
类别
Die Bonders / Sorters / Attachers
上次验证： 14 天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
New
运行状况:
未知
产品编号：
124096
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
BESI / DATACON
2200 EVO
类别
Die Bonders / Sorters / Attachers
上次验证： 14 天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
New
运行状况:
未知
产品编号：
124096
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available