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说明
Vintage-2017-2018 Complete Working Condition Ready For Production配置
2200 EVO (3GL) -See photos for configurationOEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
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PREFERRED
SELLER
类别
Die Bonders / Sorters / Attachers
上次验证： 30 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
80504
晶圆尺寸：
未知
年份：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
PREFERRED
SELLER
BESI / DATACON
2200 EVO
类别
Die Bonders / Sorters / Attachers
上次验证： 30 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
80504
晶圆尺寸：
未知
年份：
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Vintage-2017-2018 Complete Working Condition Ready For Production配置
2200 EVO (3GL) -See photos for configurationOEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
无文件