说明
Chip Attach配置
无配置OEM 型号描述
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.文件
无文件
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127486
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
HANMI
FLIP CHIP BONDER-A110
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
127486
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Chip Attach配置
无配置OEM 型号描述
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.文件
无文件