说明

DPS R1 Poly 3-chamber system

配置

Known issues: Chamber A: Additional installation required (missing parts). Chamber B: Gate valve is missing. Gas panel CHB: 3EA missing; additional installation required. System overview: Platform type: Etch Centura II Technology: Poly Etch Wafer shape: JMF Line frequency: 50 Hz / 60 Hz Details attached. Chamber configuration and locations: Position A: Poly DPS Position B: Poly DPS Position C: Poly DPS Position D: Empty Position E: Empty Position F: (OA) Orienter with narrow hoop Chamber A - Poly DPS: Application / model: DPS Poly R1 Upper chamber body: Normal anodized Process kit: Single ring Dome: Ceramic dome Electrostatic chuck (ESC) type: Polyimide ESC Turbo pump: Leybold MAG2000 Endpoint window: Quartz (QTZ) Dome & DTCU: Universal Dome & R1 DTCU Endpoint type: Monochromator Bias generator: RFPP RF-5S 500 W / 13.56 MHz Bias match: Standard Source generator: AE RF-20R 2000 W / 12.56 MHz Pressure control: Throttle valve Chamber B - Poly DPS: Application / model: DPS Poly R1 Upper chamber body: Normal anodized Process kit: Single ring Dome: Ceramic dome Electrostatic chuck (ESC) type: Polyimide ESC Turbo pump: Leybold MAG2000 Endpoint window: Quartz (QTZ) Dome & DTCU: Universal Dome & R1 DTCU Endpoint type: Monochromator Bias generator: RFPP RF-5S 500 W / 13.56 MHz Bias match: Standard Source generator: AE RF-20R 2000 W / 12.56 MHz Pressure control: Throttle gate valve with controller Chamber C - Poly DPS: Application / model: DPS Poly R1 Upper chamber body: Normal anodized Process kit: Single ring Dome: Ceramic dome Electrostatic chuck (ESC) type: Polyimide ESC Turbo pump: Leybold MAG2000 Endpoint window: Quartz (QTZ) Dome & DTCU: Universal Dome & R1 DTCU Endpoint type: Monochromator Bias generator: RFPP RF-5S 500 W / 13.56 MHz Bias match: Standard Source generator: AE RF-20R 2000 W / 12.56 MHz Pressure control: Throttle valve Gas delivery - General components: Pallet selection: Premium Valves: Fujikin / Veriflo Transducers: MKS Regulators: Fujikin / Veriflo Filters: Millipore Transducer displays: 1 display per stick MFC types: AERA 9800 & UNIT 8160 Mixing Gas pallet - Facilities: Hookup: Single Line Drop (SLD) Exhaust: BD chamber side top exhaust Controller: VME II Gas panel - CHA: Gas line requirement: 4/6-1/6 Valves: Fujikin Transducers: MKS MFCs: AERA 9800 & UNIT 8160 Gas panel - CHB: Gas line requirement: 4/6-2/6 Valves: Veriflo Transducers: MKS Regulators: Veriflo Filters: Millipore MFCs: AERA 9800 & UNIT 8160 Gas panel - CHC: Gas line requirement: 4/6-2/6 MFCs: AERA 9800 & UNIT 8160 Loadlock and cassette: Loadlock type: WBLL with auto-rotation Loadlock platform: Universal Cassette supported: KA200 85MTRHS 47C02 Loadlock cover finish: Anti-static painted Slit valve O-ring type: Kalrez Wafer mapping / cassette sensor: Enhanced wafer mapping, integrated cassette sensor included Loadlock vent: Bottom vent Transfer chamber: Lid hoist: Manual lid hoist included N2 purge MFC: 1000 sccm full scale Robot type: Centura HP+ Robot Robot blade: Roughened aluminum blade Wafer on blade detector: Basic Fab interface: Front panel: Anti-static painted Signal light tower: 3-color signal light tower (red [top], yellow [2nd], green [3rd]) with buzzer enabled System controller: Computer type: VME Controller (SBC V452 compliant) Controller type: 66-inch common controller Electrical interface: Bottom feed Controller exhaust: Top exhaust with exhaust duct Cover option: Included Adaptor for SECS port 25 Pos: Included System monitors and AC rack: Monitor type: Flat panel displays (stand alone) Monitor cables: Monitor 1 (25 feet), Monitor 2 (40 feet) AC rack type: 66-inch AC Gen Rack with 30 mA Ground Fault Interrupt (GFI) Facility interface: Remote UPS interface only Generator rack options: Features: RF On indicator, Plexiglas cover, water manifold with 3/4-inch compression tube fittings Heat exchangers / chillers: Cathode heat exchanger: Neslab HX 300 Wall heat exchanger: Neslab HX 300 Total quantity: 2 Interface: CHX heat exchanger interface Umbilicals: Controller to mainframe: 40 feet Controller to AC rack: 40 feet AC to mainframe: 40 feet System safety equipment: EMO switch type: Turn to release EMO (ETI compliant with guard ring) Smoke detectors: Included at controller and Gen Rack Water & smoke detector: Alarm installed Pump configuration: Pump interface: Interface only (Qty 4) LL chamber pump: Kashiyama SDE 120 Xfer chamber pump: Kashiyama SDE 120 Chamber A backing pump: Kashiyama SDE 120 Chamber B backing pump: Kashiyama SDE 120 Chamber C backing pump: Kashiyama SDE 120

OEM 型号描述

"This single-wafer, multi-chamber machine processes 5”, 6”, or 8” wafers for ≤200mm fabrication. Applications include: epitaxy, etch, CVD, plasma nitridation, and RTP. AMAT’s CENTURA II can accommodate up to 4 process chambers and 2 auxiliary chambers. Configuration includes load lock chambers, wafer handler robot, transfer wafer, process chambers, pneumatic panel, orientation chambergas panel, and cool down chamber. Centura II is compatible with numerous auxiliary chamber types including: Lamp Heated CVD, PE TEOS DxZ, PE Silane DxZ, Gigafill SACVD, Ultima HDP-CVD, Ultima+ HDP-CVD, Ultima tE HDP-CVD, Tungsten WxZ, ALD Tungsten, WxP Tungsten Etch (HeWeb), Tectra Titanium, Tectra Tinitride, ALD Tinitride, Reactive Preclean+, Metal Etch DPS/(+), Poly Etch DPS/(+), Poly Etch Deep Trench (DT), ASP/(+), Oxide Super-E , Oxide eMxP+, Oxide MxP+, Oxide eMax, IPS Dielectric Etch, Poly Etch MxP, Poly Etch MxP+, R2 Metal Etch, Metal Etch MxP, Mark II Etch, Orienter, and various cool down chamber mechanisms."