说明
无说明配置
Metal Etcher (4 Chamber) 208V, 50/60 Hz, with Transfer Chamber Lift, HP Robot with Metal Blade, Endpoint with Four Monochromators, Smoke and Water Leak Detect, Independent Helium Cooling, Seriplex Gas Panel w/Top Feed Exhaust, Wafer Mapping, Wafer on Blade Sensors and Umbilicals. Chamber Breakdown Includes: [Chamber A: DPS R0 Poly, w/1110-01043 Source RF match AZX 90; Dual manometers with .1Torr and 10Torr Heads, Backside Helium Cooling; 200mm Cathode, & Osaka TG2003M Turbo] [Chamber B: Poly Etch: Mark II 3 Piece Chamber; Mark II Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber C: Poly Etch: Uni-Body Chamber; MxP Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber D: DPS R1 Metal/Deep Trench Etch: Source RF Match w/AZX-90 Upgrade, Dual Manometers with .1Torr and 10Torr Heads, VAT Throttling Gate Valve, Heated Pump Stack, 200mm Cathode SNNF ESC, & Alcatel ATH 1300M Turbo] [Chamber E: Wafer Orienter, 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] [Chamber F: Wafer Orienter , 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] Remote Equipment Includes: (1ea.) RF Rack with the Following Configured Generators: [(1ea.) Advanced Energy RFG/AZX Control; (2ea.) Advanced Energy RF-20RWC; (2ea.) ENI OEM 12B-02; (1ea.) ENI OEM 12B3 and (1ea.) Osaka TD2000 turbo controller]; (2ea.) Neslab HX150 with Heater Control; (1ea.) Neslab HX150 without Heater Control; (3ea.) Edwards IH80 Pumps; & (2ea.) Alcatel ADP81 Pumps.OEM 型号描述
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.文件
无文件
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57415
晶圆尺寸：
未知
年份：
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57415
晶圆尺寸：
未知
年份：
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Metal Etcher (4 Chamber) 208V, 50/60 Hz, with Transfer Chamber Lift, HP Robot with Metal Blade, Endpoint with Four Monochromators, Smoke and Water Leak Detect, Independent Helium Cooling, Seriplex Gas Panel w/Top Feed Exhaust, Wafer Mapping, Wafer on Blade Sensors and Umbilicals. Chamber Breakdown Includes: [Chamber A: DPS R0 Poly, w/1110-01043 Source RF match AZX 90; Dual manometers with .1Torr and 10Torr Heads, Backside Helium Cooling; 200mm Cathode, & Osaka TG2003M Turbo] [Chamber B: Poly Etch: Mark II 3 Piece Chamber; Mark II Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber C: Poly Etch: Uni-Body Chamber; MxP Shields, MxP Magnets, ESC Cathode, Phase IV RF Match, & Alcatel 5402 CTS Turbo] [Chamber D: DPS R1 Metal/Deep Trench Etch: Source RF Match w/AZX-90 Upgrade, Dual Manometers with .1Torr and 10Torr Heads, VAT Throttling Gate Valve, Heated Pump Stack, 200mm Cathode SNNF ESC, & Alcatel ATH 1300M Turbo] [Chamber E: Wafer Orienter, 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] [Chamber F: Wafer Orienter , 200mm Lift Hoop, 200mm Pedestal, Laser, & CCD Array] Remote Equipment Includes: (1ea.) RF Rack with the Following Configured Generators: [(1ea.) Advanced Energy RFG/AZX Control; (2ea.) Advanced Energy RF-20RWC; (2ea.) ENI OEM 12B-02; (1ea.) ENI OEM 12B3 and (1ea.) Osaka TD2000 turbo controller]; (2ea.) Neslab HX150 with Heater Control; (1ea.) Neslab HX150 without Heater Control; (3ea.) Edwards IH80 Pumps; & (2ea.) Alcatel ADP81 Pumps.OEM 型号描述
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.文件
无文件