说明
Details Attached Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher配置
configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. Engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications.OEM 型号描述
HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.文件
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HITACHI
HS-9050
类别
Dry / Plasma Etch
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
143410
晶圆尺寸：
12"/300mm
年份：
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available