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HITACHI HS-9050
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
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    无文件

    verified-listing-icon

    已验证

    类别
    Dry / Plasma Etch

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    125857


    晶圆尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch
    年份: 2019状况: 二手
    上次验证60 多天前

    HITACHI

    HS-9050

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 60 多天前
    listing-photo-685e2c08e9084a31a63940661e0110c8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/80245/685e2c08e9084a31a63940661e0110c8/e9dcc3ba1435409d8d16d882fd3ec764_hincoppertoolpage06image0001_mw.jpg
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    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    125857


    晶圆尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    文件

    无文件

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    查看全部
    HITACHI HS-9050

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