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LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
  • LAM RESEARCH CORPORATION 2300 VERSYS KIYO
说明
Metal Etch
配置
2300 KIYO EX
OEM 型号描述
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.
文件

无文件

类别
Dry / Plasma Etch

上次验证: 30 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

62675


晶圆尺寸:

12"/300mm


年份:

2009


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH CORPORATION

2300 VERSYS KIYO

verified-listing-icon
已验证
类别
Dry / Plasma Etch
上次验证: 30 多天前
listing-photo-65d582a1169d4f49a4ae43cfa7e60900-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

62675


晶圆尺寸:

12"/300mm


年份:

2009


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Metal Etch
配置
2300 KIYO EX
OEM 型号描述
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.
文件

无文件