跳至主要内容
Moov logo

Moov Icon
LAM RESEARCH CORPORATION 2300 VERSYS KIYO45
    说明
    (E4 Frame) ETCHER
    配置
    无配置
    OEM 型号描述
    The 2300 Versys Kiyo45 is a Reactive Ion Etch (RIE) system from Lam Research, part of the Kiyo Product Family. It is used to shape the electrically active materials of a semiconductor device with high precision and consistency. The Kiyo product family is known for its high-performance capabilities and productivity. The Versys Kiyo45 is used for various applications, including shallow trench isolation, source/drain engineering, high-k/metal gate, FinFET and tri-gate, and multi-patterning. It enables processing at sub-65 nm technology nodes.
    文件

    无文件

    类别
    Dry / Plasma Etch

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    127499


    晶圆尺寸:

    未知


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH CORPORATION

    2300 VERSYS KIYO45

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 30 多天前
    listing-photo-00e80d2721af490886ec5b6e22353b84-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    127499


    晶圆尺寸:

    未知


    年份:

    2011


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    (E4 Frame) ETCHER
    配置
    无配置
    OEM 型号描述
    The 2300 Versys Kiyo45 is a Reactive Ion Etch (RIE) system from Lam Research, part of the Kiyo Product Family. It is used to shape the electrically active materials of a semiconductor device with high precision and consistency. The Kiyo product family is known for its high-performance capabilities and productivity. The Versys Kiyo45 is used for various applications, including shallow trench isolation, source/drain engineering, high-k/metal gate, FinFET and tri-gate, and multi-patterning. It enables processing at sub-65 nm technology nodes.
    文件

    无文件