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TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
    说明
    Telius SP 305 SCCM Dielectric Etch Process Oxide Oxide Etch (3) Shin Chamber (6) EMO Front 3ea, Rear (3) RF Generator TOP (3) RF Generator BTM (3) RF Matcher TOP (3) RF Matcher BTM (12) Gas Line
    配置
    无配置
    OEM 型号描述
    Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
    文件
    类别
    Dry / Plasma Etch

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    81928


    晶圆尺寸:

    12"/300mm


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
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    TEL / TOKYO ELECTRON

    TELIUS SP 305 SCCM

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 60 多天前
    listing-photo-2b4430dac1b04f70ba5da399399bf179-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    81928


    晶圆尺寸:

    12"/300mm


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Telius SP 305 SCCM Dielectric Etch Process Oxide Oxide Etch (3) Shin Chamber (6) EMO Front 3ea, Rear (3) RF Generator TOP (3) RF Generator BTM (3) RF Matcher TOP (3) RF Matcher BTM (12) Gas Line
    配置
    无配置
    OEM 型号描述
    Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
    文件
    类似上架物品
    查看全部