说明
Dielectric Etch配置
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEM 型号描述
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.文件
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
已验证
类别
Dry / Plasma Etch
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
20225
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
类别
Dry / Plasma Etch
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
20225
晶圆尺寸：
12"/300mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dielectric Etch配置
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEM 型号描述
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.文件
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