We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
BMP配置
无配置OEM 型号描述
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.文件
无文件
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105629
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105629
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
BMP配置
无配置OEM 型号描述
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.文件
无文件