说明
ECD (Electro Chemical Deposition)配置
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 型号描述
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文件
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LAM RESEARCH / NOVELLUS
SABRE 3D
已验证
类别
Electro Plating
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56903
晶圆尺寸：
12"/300mm
年份：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
类别
Electro Plating
上次验证： 16 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56903
晶圆尺寸：
12"/300mm
年份：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ECD (Electro Chemical Deposition)配置
Mfg. Date: 2014-01-01 Wafer Size: 300mm Software Version v 1.07b1 System Power Rating 208 3 Phase Loading Configuration 3 LP Chamber Description Chamber Chemicals Gases Chamber 1 APT Duet H2O2 Chamber 4 Plating Duets Cu Sulfate Chamber 2 EBR Duets Sulfuric Acid and Hydrogen Peroxide • Includes Chemical Analyzer. • Include jigs, setup fixtures • 1. 1 apt duet • 2. 4 Cu duet • 3. 2 EBR duetOEM 型号描述
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文件
无文件