说明
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): Yes配置
无配置OEM 型号描述
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文件
无文件
类别
Electro Plating
上次验证： 3 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
136188
晶圆尺寸：
8"/200mm
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE 3D
类别
Electro Plating
上次验证： 3 天前
物品主要详细信息
状况：
Used
运行状况:
Installed / Running
产品编号：
136188
晶圆尺寸：
8"/200mm
年份：
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Plator Off Status: PROD Deminsion (cm): 630x197x275 Weight kg: 3,000.00 2F Rigging (Yes or No): Yes配置
无配置OEM 型号描述
The SABRE 3D electroplating system is a highly flexible and modular architecture that can perform a wide range of high-productivity wafer-level packaging (WLP) processes. These include copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping. It is specifically designed for the advanced WLP market. The Sabre 3D can produce wafers up to 12 inches in size and has a TSV ECP of 12 inches . The system incorporates many of the technologies used in the SABRE platform, such as sealed dry contacts, innovative clamshell and cell design, SmartDose bath control, and precision wafer handling.文件
无文件