We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
In Good ConditionOEM 型号描述
The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.文件
无文件
PREFERRED
SELLER
类别
Electro Plating
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
59918
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
PREFERRED
SELLER
LAM RESEARCH / NOVELLUS
SABRE xT
类别
Electro Plating
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
59918
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
In Good ConditionOEM 型号描述
The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.文件
无文件