说明
ECD (Electro Chemical Deposition)配置
无配置OEM 型号描述
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文件
无文件
类别
Electro Plating
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135515
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
SABRE EXTREME
类别
Electro Plating
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135515
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ECD (Electro Chemical Deposition)配置
无配置OEM 型号描述
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文件
无文件