说明
HG-CV System for EPI resistivity measurement配置
无配置OEM 型号描述
The SSM 530 is a fully automatic mapping system that provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. It has the same abilities as the SSM 5130, but it does not have a robot. The SSM 530 eliminates the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. It features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications. Typical applications include EPI resistivity, low-k dielectric constant, and oxide integrity. The system can handle wafer diameters from 200 mm to 300 mm and can perform single-site and multiple-site maps. It also features automatic face-up loading to prevent wafer damage, precision pressure regulators for Hg contact, and PROCAP software that provides a full suite of measurements.文件
无文件
SSM
530
已验证
类别
EPI Resistivity Measurement
上次验证： 30 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115112
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SSM
530
类别
EPI Resistivity Measurement
上次验证： 30 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115112
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
HG-CV System for EPI resistivity measurement配置
无配置OEM 型号描述
The SSM 530 is a fully automatic mapping system that provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. It has the same abilities as the SSM 5130, but it does not have a robot. The SSM 530 eliminates the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. It features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications. Typical applications include EPI resistivity, low-k dielectric constant, and oxide integrity. The system can handle wafer diameters from 200 mm to 300 mm and can perform single-site and multiple-site maps. It also features automatic face-up loading to prevent wafer damage, precision pressure regulators for Hg contact, and PROCAP software that provides a full suite of measurements.文件
无文件