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说明
无说明配置
240mm electrode Available gas in the chamber: Ar, CF4, O2, CHF3, SF6 & He. Max flow rate per gas: 100 sccm Wafer size: Small piece of wafer until max full 8 inches wafer RF generator: 300 Watt 13.56MHz Table : Only cooled down, no heating. Typical process pressure: 30 – 100 mtorr Pumping system: Corrosion-resistant turbo-molecular pump with rotary pumpOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
无文件
类别
Etch/Asher
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
126924
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 80 PLUS
类别
Etch/Asher
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
126924
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
240mm electrode Available gas in the chamber: Ar, CF4, O2, CHF3, SF6 & He. Max flow rate per gas: 100 sccm Wafer size: Small piece of wafer until max full 8 inches wafer RF generator: 300 Watt 13.56MHz Table : Only cooled down, no heating. Typical process pressure: 30 – 100 mtorr Pumping system: Corrosion-resistant turbo-molecular pump with rotary pumpOEM 型号描述
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文件
无文件